Semiconductor structure with metal migration semiconductor...

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Electromagnetic or particle radiation

Reexamination Certificate

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C257S434000, C257S751000

Reexamination Certificate

active

10739755

ABSTRACT:
A semiconductor structure includes a semiconductor substrate, a semiconductor active region, a semiconductor contact layer, at least one metal migration semiconductor barrier layer, and a metal contact. The metal migration semiconductor barrier layer may be embedded within the semiconductor contact layer. Furthermore, the metal migration semiconductor barrier layer may be located underneath or above and in intimate contact with the semiconductor contact layer. The metal migration semiconductor barrier layer and the semiconductor contact layer form a contact structure that prevents metals from migrating from the metal contact into the semiconductor active layer during long-term exposure to high temperatures. By providing a robust contact structure that may be used in semiconductor structures, for example in solar cells that power spacecraft or terrestrial solar cells used under concentrated sunlight, the high temperature reliability of the semiconductor structure will be improved and the operation time will be prolonged.

REFERENCES:
patent: 5822348 (1998-10-01), Fujii
patent: 6346431 (2002-02-01), Yoo et al.
patent: 2002/0050644 (2002-05-01), Matsumoto et al.
patent: 2002/0053676 (2002-05-01), Kozaki
patent: WO 87/03742 (1987-06-01), None

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