Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Patent
1997-09-24
2000-05-09
Nguyen, Khiem
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
H01R 909
Patent
active
060595795
ABSTRACT:
An assembly and process for connecting opposed semiconductor structures (12,14) comprising at least two structures. An interconnect (16) between the structures (12,14) connects the structures in opposed spaced relation to each other. The interconnect comprises a first material (18) and a second material (20). The first material comprises a resiliently flexible center portion. The second material comprises an electrically conductive outer portion surrounding the first material. The second material and the first material provide the interconnect with a flexibly compliant characteristic for maintaining an electrically conductive relationship between the structures.
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Kresge John S.
Moore Scott P.
Susko Robin A.
Wilson James W.
Duverne J. F.
International Business Machines - Corporation
Nguyen Khiem
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