Semiconductor structure having stacked semiconductor devices

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C257S723000

Reexamination Certificate

active

10409008

ABSTRACT:
A semiconductor structure includes flip chips or other semiconductor devices that are mounted on printed circuit boards. The printed circuit boards are stacked to increase the circuit density of the semiconductor structure. The printed circuit boards include cavities or openings to accommodate the flip chips or semiconductor devices and thus reduce the overall size of the semiconductor structure. The flip chips or semiconductor devices from adjacent printed circuit boards may extend into the cavities or openings or simply occupy the cavities or openings from the same printed circuit board.

REFERENCES:
patent: 5012323 (1991-04-01), Farnworth
patent: 5121293 (1992-06-01), Conte
patent: 5128831 (1992-07-01), Fox, III et al.
patent: 5189505 (1993-02-01), Bartelink
patent: 5289337 (1994-02-01), Aghazadeh et al.
patent: 5291061 (1994-03-01), Ball
patent: 5323060 (1994-06-01), Fogal et al.
patent: 5385869 (1995-01-01), Liu et al.
patent: 5422435 (1995-06-01), Takiar et al.
patent: 5434745 (1995-07-01), Shokrgozar et al.
patent: 5474957 (1995-12-01), Urushima
patent: 5495398 (1996-02-01), Takiar et al.
patent: 5513076 (1996-04-01), Werther
patent: 5535101 (1996-07-01), Miles et al.
patent: 5607099 (1997-03-01), Yeh et al.
patent: 5784260 (1998-07-01), Fuller, Jr. et al.
patent: 5945741 (1999-08-01), Ohsawa et al.
patent: 5963430 (1999-10-01), Londa
patent: 6008536 (1999-12-01), Mertol
patent: 6020629 (2000-02-01), Farnworth et al.
patent: 6025648 (2000-02-01), Takahashi et al.
patent: 6137163 (2000-10-01), Kim et al.
patent: 6172419 (2001-01-01), Kinsman
patent: 6313522 (2001-11-01), Akram et al.
patent: 6531337 (2003-03-01), Akram et al.
patent: 6531338 (2003-03-01), Akram et al.
patent: 0 488 057 (1992-06-01), None
patent: 3-261165 (1991-11-01), None
patent: 4-110653 (1992-04-01), None
patent: 5-82567 (1993-04-01), None
patent: 5-326625 (1993-12-01), None
patent: 6-224246 (1994-08-01), None
Nikkei Electronics, Feb. 28, 1994, No. 602, pp. 111-117.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Semiconductor structure having stacked semiconductor devices does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor structure having stacked semiconductor devices, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor structure having stacked semiconductor devices will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3734645

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.