Semiconductor structure having alpha particle resistant film and

Details Semiconductor structure having alpha particle resistant film and Semiconductor structure having alpha particle resistant film and

1986-03-04

1987-03-31

Smith, John D.

Metal working

Method of mechanical manufacture

Assembling or joining

29583, 156237, 156239, 156241, 427 5, 427 82, H01L 21312

Patent

active

046531750

ABSTRACT:
An applique of a prepatterned film of alpha particle resistant material, such as polyimide, is applied to a semiconductor wafer. The prepatterned film covers only the critical areas e.g. those affected by alpha particle impingement. Bond pads and scribe streets are not covered by the applique.

REFERENCES:
patent: 3738888 (1973-06-01), Williams
patent: 4423548 (1984-01-01), Hulseweh
patent: 4468411 (1984-08-01), Sloan
patent: 4481526 (1984-11-01), Miyasaka
"Polyimide Film--not Liquid--Shields RAMs . . . " Elec. Des. 11/22/80.

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