Semiconductor structure avoiding poly stringer formation

Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Including dielectric isolation means

Reexamination Certificate

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C257S509000, C257S506000, C257SE21545, C438S298000

Reexamination Certificate

active

10967131

ABSTRACT:
The present invention discloses a semiconductor structure avoiding the poly stringer formation in semiconductor processing. A semiconductor device is divided into a memory cell area and a peripheral portion. A plurality of parallel first isolation devices are positioned in the semiconductor substrate in the memory cell area. A second isolation device is positioned in the semiconductor substrate in the peripheral portion, and parallel with the first isolation device. A dummy buried doping region is positioned in the semiconductor substrate, and is positioned between the memory cell device and the peripheral portion and parallel with the second isolation device. An oxide area is formed on the dummy buried doping region. The dummy buried doping region and the oxide region can prevent poly string formation during subsequent processing.

REFERENCES:
patent: 4855800 (1989-08-01), Esquivel et al.
patent: 5045489 (1991-09-01), Gill et al.
patent: 5173436 (1992-12-01), Gill et al.
patent: 5844270 (1998-12-01), Kim et al.

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