Semiconductor structure and method of manufacture

Semiconductor device manufacturing: process – Formation of electrically isolated lateral semiconductive... – Having air-gap dielectric

Reexamination Certificate

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C438S514000, C438S522000, C438S765000, C438S766000, C438S769000, C438S770000, C438S775000, C438S778000, C257S522000

Reexamination Certificate

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07811896

ABSTRACT:
In various embodiments, semiconductor structures and methods to manufacture these structures are disclosed. In one embodiment, a method to manufacture a semiconductor structure includes forming a cavity in a substrate. A portion of the substrate is doped, or a doped material is deposited over a portion of the substrate. At least a portion of the doped substrate or at least a portion of the doped material is converted to a dielectric material to enclose the cavity. The forming of the cavity may occur before or after the doping of the substrate or the depositing of the doped material. Other embodiments are described and claimed.

REFERENCES:
patent: 4356211 (1982-10-01), Riseman
patent: 5792706 (1998-08-01), Michael et al.
patent: 5846849 (1998-12-01), Shaw et al.
patent: 6274920 (2001-08-01), Park et al.
patent: 6617252 (2003-09-01), Davies
patent: 6949444 (2005-09-01), Torres et al.
patent: 7084043 (2006-08-01), Birner et al.
patent: 2002/0052092 (2002-05-01), Lachner
patent: 2003/0146490 (2003-08-01), Averett et al.
patent: 2003/0176055 (2003-09-01), Wu
patent: 2005/0101045 (2005-05-01), Shih et al.
patent: 2006/0258037 (2006-11-01), Fischer et al.
patent: 2007273993 (2007-10-01), None
patent: 2009/076510 (2009-06-01), None
International Search Report and Written Opinion for PCT Patent Application No. PCT/US2008/86384, mailed on Jul. 27, 2009, 11 pages.
International Preliminary Report on Patentability received for PCT Application No. PCT/US2008/086384, Mailed on Jun. 24, 2010, 6 pages.

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