Semiconductor device manufacturing: process – Formation of electrically isolated lateral semiconductive... – Having air-gap dielectric
Reexamination Certificate
2008-12-08
2010-10-12
Nguyen, Ha Tran T (Department: 2829)
Semiconductor device manufacturing: process
Formation of electrically isolated lateral semiconductive...
Having air-gap dielectric
C438S514000, C438S522000, C438S765000, C438S766000, C438S769000, C438S770000, C438S775000, C438S778000, C257S522000
Reexamination Certificate
active
07811896
ABSTRACT:
In various embodiments, semiconductor structures and methods to manufacture these structures are disclosed. In one embodiment, a method to manufacture a semiconductor structure includes forming a cavity in a substrate. A portion of the substrate is doped, or a doped material is deposited over a portion of the substrate. At least a portion of the doped substrate or at least a portion of the doped material is converted to a dielectric material to enclose the cavity. The forming of the cavity may occur before or after the doping of the substrate or the depositing of the doped material. Other embodiments are described and claimed.
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International Preliminary Report on Patentability received for PCT Application No. PCT/US2008/086384, Mailed on Jun. 24, 2010, 6 pages.
Cool Kenneth J.
Cool Patent P.C.
HVVi Semiconductors, Inc.
Kusumakar Karen M
Nguyen Ha Tran T
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