Semiconductor structure and method of manufacture

Details Semiconductor structure and method of manufacture Semiconductor structure and method of manufacture

2008-09-11

2010-10-12

Pham, Long (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified configuration

C257S765000, C257S767000

Reexamination Certificate

active

07812454

ABSTRACT:
In various embodiments, semiconductor structures and methods to manufacture these structures are disclosed. In one embodiment, an electrical bus embedded in a dielectric material below a surface of a semiconductor substrate is disclosed. Other embodiments are described and claimed.

REFERENCES:
patent: 6200894 (2001-03-01), Licata et al.
patent: 2002/0081835 (2002-06-01), Park et al.
patent: 2004/0155287 (2004-08-01), Omura et al.
patent: 2006/0197154 (2006-09-01), Pelella et al.
patent: 57160142 (1982-10-01), None
patent: 2009/055156 (2009-04-01), None
“International Search Report/Written Opinion Received for PCT Application No. PCT/US2008/076032 mailed on Jan. 30, 2009”, 12 Pages.
International Preliminary Report on Patentability/Written Opinion received for PCT Application No. PCT/US2008/076032, mailed on May 6, 2010, 7 pages.

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