Semiconductor structure and method of manufacture

Details Semiconductor structure and method of manufacture Semiconductor structure and method of manufacture

1994-08-19

1995-12-19

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437206, 437211, 437214, 437217, H01L 2160

Patent

active

054768187

ABSTRACT:
A semiconductor structure (8) comprising a semiconductor chip support structure (9), a circuit board substrate (40) with circuit board substrate probes (36) extending therefrom and a method for fabricating the semiconductor structure (8). The semiconductor chip support structure (9) includes, for example, clips (43, 53) to replaceably mount semiconductor chips (47, 48) to the semiconductor chip support structure (9). The circuit board substrate (40) is mated with the semiconductor chip support structure (9) so that the circuit board substrate probes (36) contact bonding pads (49) on the semiconductor chips (47, 48). If a semiconductor chip (47, 48) becomes damaged, the circuit board substrate (40) may be separated from the semiconductor chip support structure (9) and the damaged semiconductor chip (47, 48) replaced with a good semiconductor chip (47, 48).

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Munchmeyer et al., "Manufacture of three-dimensional microdevices using synchrotron radiation (Invited)", Rev. Sci Instrum. 63(1), Jan. 1992, pp. 713-721.
C. Barsotti et al., "Very High Density Probing", 1988 International Test Conference, Paper 30.2, pp. 608-614, Apr. 1988.

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