Semiconductor string connection structure

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357 70, 357 65, H01L 2348

Patent

active

049491563

ABSTRACT:
A semiconductor string connection structure comprising a plurality of encasements, each of which has a light emitting diode chip and a pair of conducting leads, a plurality of binding pieces connected between the encasements, a plurality of longitudinal pieces disposed between two pairs of the conducting leads or at the right-most or left-most side thereof, a plurality of transverse thin pieces connected with the leads and longitudinal pieces, and a transverse plate disposed and connected with lower ends of the leads and longitudinal piece. The transverse plate serves as a common line, therefore, the lower half of the semiconductor string connection structure is folded 180 degrees such that the whole structure can be mounted on a circuit board to form a large display.

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