Measuring and testing – Speed – velocity – or acceleration – Acceleration determination utilizing inertial element
Patent
1990-08-31
1992-09-29
Raevis, Robert
Measuring and testing
Speed, velocity, or acceleration
Acceleration determination utilizing inertial element
G01P 1508
Patent
active
051506165
ABSTRACT:
A semiconductor strain sensor having a stem with a lead hole in which a lead terminal is installed and electrically coupled to an external circuit. A sensor chip having piezo-resistors to a bride circuit is joined with a front surface of the stem. A shell is joined with the front surface of the stem by projection welding after the back surface of the stem is flattened to within a predetermined limit. A space formed by the shell and stem is filled with a damping liquid. The stem is integrally coupled to the sensor chip through an adhesive, and spacers are added to the adhesive to keep the thickness of the adhesive to a predetermined value. This arrangement can effectively prevent propagation of the welding strain of the stem from adversely affecting the sensor chip.
REFERENCES:
patent: 3609624 (1971-09-01), Nagy
patent: 3923581 (1975-12-01), Payne et al.
patent: 4829822 (1989-05-01), Imai et al.
patent: 4967605 (1990-11-01), Okada
patent: 4987781 (1991-01-01), Reimann
"A Batch--Fabricated Silicon Accelerometer" by L. M. Roylance et al; IEEE Transactions on Electron Devices, vol. ED-26, No. 12, Dec. 1979.
Journal of Nippondenso Technical Disclosure by Tsuzuki; Mar. 15, 1987.
Imai Masahito
Kondo Munenari
Maeda Takushi
Narita Ryoichi
Nippondenso Co. Ltd.
Raevis Robert
LandOfFree
Semiconductor strain sensor and manufacturing method thereof does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Semiconductor strain sensor and manufacturing method thereof, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor strain sensor and manufacturing method thereof will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1962504