Semiconductor device manufacturing: process – Gettering of substrate – By layers which are coated – contacted – or diffused
Reexamination Certificate
2008-08-18
2009-12-08
Mulpuri, Savitri (Department: 2812)
Semiconductor device manufacturing: process
Gettering of substrate
By layers which are coated, contacted, or diffused
C438S287000, C438S591000, C438S593000, C257SE21422, C257SE21497, C257SE21639
Reexamination Certificate
active
07629232
ABSTRACT:
A non-volatile semiconductor storage device having a high-dielectric-constant insulator and a manufacturing method thereof suitable for miniaturization are disclosed. According to one aspect of the present invention, it is provided a semiconductor storage device comprising a semiconductor substrate, a plurality of first conductor layers formed on the semiconductor substrate through a first insulator, an isolation formed between the plurality of first conductor layers, a silicon oxide film formed on the first conductor layer, a high-dielectric-constant insulator formed on the silicon oxide film and the isolation and being diffused silicon and oxygen at least in a surface thereof contacting with the silicon oxide film, and a second conductor film formed above the high-dielectric-constant insulator.
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U.S. Appl. No. 12/234,190, filed Sep. 19, 2008, Nagano, et al.
Ishida Hirokazu
Tanaka Masayuki
Kabushiki Kaisha Toshiba
Lee Cheung
Mulpuri Savitri
Oblon, Spivak McClelland, Maier & Neustadt, L.L.P.
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