Semiconductor stack structures and fabrication/sparing methods u

Details Semiconductor stack structures and fabrication/sparing methods u Semiconductor stack structures and fabrication/sparing methods u

1994-03-30

1996-03-26

Mintel, William

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

257686, 257690, 257723, 257773, H01L 2302

Patent

active

055023339

ABSTRACT:
Electronic semiconductor structures utilize an electrically programmable spare circuit incorporated with a multichip package. The programmable sparing capability in the multichip package is accomplished either with or without the inclusion of a spare chip(s). With a spare memory circuit, individual failed memory cells in the semiconductor chips of a stack can be functionally replaced by memory cells of the spare memory circuit subsequent to encapsulation and burn-in testing. With use of a spare chip, non-volatile sparing can occur subsequent to encapsulation and burn-in testing without physical rewiring of a wire bond connection. Specific details of alternate electronic semiconductor structures, and fabrication and sparing methods therefore, are set forth.

REFERENCES:
patent: 4312046 (1982-01-01), Taylor
patent: 4584681 (1986-04-01), Singh et al.
patent: 4697095 (1987-09-01), Fujii
patent: 4731760 (1988-03-01), Maini
patent: 4770640 (1988-09-01), Walter
patent: 4918335 (1990-04-01), Chall, Jr.
patent: 5179540 (1993-01-01), Stockton
patent: 5266833 (1993-11-01), Capps
patent: 5315552 (1994-05-01), Yoneda
patent: 5386386 (1995-01-01), Ogihara
Fitzpatrick et al., "Redundancy Using Platinum-Silicon Fuses," IBM Technical Disclosure Bulletin, vol. 29, No. 10, pp. 4612-4615, Mar. 1987.

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