Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Reexamination Certificate
2005-03-08
2005-03-08
Abrams, Neil (Department: 2839)
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
Reexamination Certificate
active
06863541
ABSTRACT:
A semiconductor socket is provided which includes a stage used for positioning of a semiconductor device. The semiconductor device has a plurality of external input/output terminals mounted at a bottom thereof. The semiconductor socket also has a plurality of probes used to come into contact with the plurality of external input/output terminals when the semiconductor device has been positioned, by moving the stage towards the probes. The semiconductor socket has a socket base in which a major portion of each of the probes is housed, and from which a minor portion of each of the probes projects from an upper face thereof. The upper face of the socket base faces the stage. The probes are disposed in a manner so as to be inserted in or pulled out from the upper face. The semiconductor socket has a probe retaining cap removably mounted to the upper face of the socket base, for preventing the probes from being removed. A method of replacing the probes is also proposed.
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