Semiconductor - slice cleaving

Details Semiconductor - slice cleaving Semiconductor - slice cleaving

1993-07-19

1995-02-28

Breneman, R. Bruce

Fishing, trapping, and vermin destroying

148DIG28, 437129, H01L 21304

Patent

active

053937074

ABSTRACT:
Cleavage of a semiconductor slice is initiated at a peck-mark formed in the upper surface at one edge of the slice by bending the slice over a cutting edge of a semiconductor slice dicing wheel. The cleave is propagated to the far edge of the slice by relative sliding movement of the wheel across the underside of the slice.

REFERENCES:
patent: 4469500 (1984-09-01), Miller
patent: 4590667 (1986-05-01), Simon
patent: 5128282 (1992-07-01), Ormond et al.
patent: 5174188 (1992-12-01), Petroz
patent: 5272114 (1993-12-01), van Berkum et al.

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