Semiconductor sensor production method and semiconductor sensor

Details Semiconductor sensor production method and semiconductor sensor Semiconductor sensor production method and semiconductor sensor

2006-07-18

2009-12-08

Smith, Matthew (Department: 2823)

Semiconductor device manufacturing: process

Chemical etching

Vapor phase etching

C438S050000, C257SE21232

Reexamination Certificate

active

07629263

ABSTRACT:
A semiconductor sensor production method includes the steps of (A) forming a first etching mask layer on a support part segment of a backside semiconductor layer, except on a portion of the support part segment which portion is along edges of the support part segment; (B) forming a second etching mask layer on the support part segment and a proof mass part segment of the backside semiconductor layer; (C) selectively removing segments of the back side semiconductor layer between the proof mass part segment and the support part segment by performing etching; (D) making the proof mass part segment of the back side semiconductor layer thinner than the support part segment of the back side semiconductor layer by performing etching; and (E) removing the first etching mask layer by using a wet etching method.

REFERENCES:
patent: 6458615 (2002-10-01), Fedder et al.
patent: 7350424 (2008-04-01), Hjelt et al.
patent: 2006/0141786 (2006-06-01), Boezen et al.
patent: 2006/0272414 (2006-12-01), Ayazi et al.
patent: 2008/0196497 (2008-08-01), Suzuki
patent: 2003-270262 (2003-09-01), None
patent: 2005-049130 (2005-02-01), None

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