Semiconductor sensor anodic-bonding process, wherein bonding of

Details Semiconductor sensor anodic-bonding process, wherein bonding of Semiconductor sensor anodic-bonding process, wherein bonding of

1993-10-26

1996-08-13

Kunemund, Robert

Fishing, trapping, and vermin destroying

437901, 437927, 73718, 73724, 3612834, H01L 2146, G01L 912, H01G 700

Patent

active

055455948

ABSTRACT:
A method for bonding a silicon substrate and a glass substrate through an anodic-bonding process, including steps of: forming at least two holes in the glass substrate; forming a recess on the glass substrate, the recess confronting an undesired bonding portion defined in the silicon substrate; depositing a metal layer on the glass substrate with a predetermined pattern; depositing a dielectric layer on the metal layer, the insulating layer covering substantially the entire surface of the metal layer; and bonding the glass substrate and the semiconductor material.

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