Semiconductor sensor and manufacturing method therefor

Details Semiconductor sensor and manufacturing method therefor Semiconductor sensor and manufacturing method therefor

2006-06-20

2008-05-20

Raevis, Robert (Department: 2856)

Measuring and testing

Speed, velocity, or acceleration

Acceleration determination utilizing inertial element

Reexamination Certificate

active

07373821

ABSTRACT:
A semiconductor sensor is disclosed that includes a semiconductor substrate, a sensing portion provided on the semiconductor substrate, and a pad in electrical communication with the sensing portion and provided on the semiconductor substrate. The semiconductor sensor also includes a bonding wire in electrical communication with the pad. Furthermore, the semiconductor sensor includes a cover member with a covering portion disposed over the semiconductor substrate for covering the sensing portion such that the covering portion is separated at a distance from the sensing portion. The cover member further includes a coupling portion provided on the semiconductor substrate at an area including the pad and for enabling electrical connection of the pad with the bonding wire therethrough.

REFERENCES:
patent: 5185498 (1993-02-01), Sanftleben et al.
patent: 5545912 (1996-08-01), Ristic et al.
patent: 5571994 (1996-11-01), Norton
patent: 6294028 (2001-09-01), Bell et al.
patent: 6323550 (2001-11-01), Martin et al.
patent: 6656368 (2003-12-01), Schoefthaler et al.
patent: 6861848 (2005-03-01), Kasai et al.
patent: 6949807 (2005-09-01), Eskridge et al.
patent: 6951824 (2005-10-01), Fischer et al.

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