Semiconductor sealing silicone composition and semiconductor...

Stock material or miscellaneous articles – Composite – Of silicon containing

Reexamination Certificate

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C528S015000, C528S020000, C528S032000, C525S478000

Reexamination Certificate

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06969554

ABSTRACT:
A silicon composition as described below, which is suitable for sealing semiconductors, is provided. The silicone composition comprises (A) a diorganopolysiloxane with at least two alkenyl groups bonded to silicon atoms, (B) an organohydrogenpolysiloxane with at least two hydrogen atoms bonded to silicon atoms, (C) an adhesion imparting constituent, (D) a platinum group metal based catalyst, and (E) a compound represented by a general formula (1):(wherein, R1represents a monovalent hydrocarbon group of at least 10 carbon atoms, which may contain a hydroxyl group or an ether linkage). The silicon composition displays excellent adhesion to semiconductor chips, and enables the production of a semiconductor device with superior resistance to moisture permeation.

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patent: 3775452 (1973-11-01), Karstedt
patent: 5036024 (1991-07-01), Mine et al.
patent: 5529837 (1996-06-01), Fujiki et al.
patent: 5629387 (1997-05-01), Frances et al.
patent: 8-269339 (1996-10-01), None

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