Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Encapsulating
Reexamination Certificate
2005-05-26
2011-10-11
Pizarro, Marcos D. (Department: 2814)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Encapsulating
C257S787000, C257S678000
Reexamination Certificate
active
08034667
ABSTRACT:
A semiconductor sealing resin sheet is composed of a supporting sheet and a sealing resin layer releasably laminated on the supporting sheet, wherein the sealing resin layer has a thermosetting property, the elastic modulus of the sealing resin layer before thermosetting is 1.0×103to 1.0×104Pa, the melt viscosity 120° C. of the sealing resin layer before thermosetting is 100 to 200 Pa·s, and the time required for the melt viscosity to reach its minimum value is 60 sec or less when the sealing resin layer before thermosetting is kept at a constant temperature of 120° C. A method for manufacturing semiconductor devices includes the steps of preparing a circuit substrate with a semiconductor chip mounted thereon, the circuit substrate is heated, the surface of the sealing resin layer in the semiconductor sealing resin sheet described above is embedded in concavo-convex parts and gaps on the semiconductor-chip-mounted surface of the circuit substrate, and the surface of the sealing resin layer is brought into contact with the surface of the circuit substrate and then the sealing resin layer is thermally cured.
REFERENCES:
patent: 5126188 (1992-06-01), Shimizu et al.
patent: 5381039 (1995-01-01), Morrison
patent: 6277481 (2001-08-01), Sugino et al.
patent: 6590070 (2003-07-01), Toriumi et al.
patent: 6620862 (2003-09-01), Ueda et al.
patent: 6919262 (2005-07-01), Senoo et al.
patent: 2001/0009342 (2001-07-01), Furukawa et al.
patent: 2003/0183947 (2003-10-01), Ohuchi
patent: 2005/0029906 (2005-02-01), Miyaji
patent: 2008/0241995 (2008-10-01), Fukui et al.
patent: 1088870 (2001-04-01), None
patent: 1244143 (2002-09-01), None
patent: 1763070 (2007-03-01), None
patent: 3208221 (1991-09-01), None
patent: 9-008179 (1997-01-01), None
patent: 11-251347 (1999-09-01), None
patent: 2001-332520 (2001-11-01), None
patent: 2003-298389 (2003-10-01), None
patent: 2004123796 (2004-04-01), None
patent: 2004037939 (2004-05-01), None
Brostow, Witold et al., “Cure progress in epoxy systems: dependence on temperature and time”, Materials Research Innovations, vol. 7, No. 3, Jun. 2003, pp. 125-132.
Tajima, Yuji A. et al., “Chemorheology of an Amine-Cured Epoxy Resin”, Polymer Engineering and Science, vol. 26, No. 6, Mar. 1986, pp. 427-431.
Shinoda Tomonori
Yamazaki Osamu
Lintec Corporation
Montalvo Eva Yan
Pizarro Marcos D.
The Webb Law Firm
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