Semiconductor sealing epoxy resin composition

Details Semiconductor sealing epoxy resin composition Semiconductor sealing epoxy resin composition

1990-11-09

1991-07-23

Jacobs, Lewis T.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Processes of preparing a desired or intentional composition...

525476, C08L 8304, C08L 6300

Patent

active

050344366

ABSTRACT:
A semiconductor sealing epoxy resin composition includes a flexibilizer which is a previous reactant between a denatured silicone oil having epoxy groups and a phenol novolak resin, a novolak type of epoxy resin, a hardening agent, an accelerator, a filler, a die lubricant, and a surface treatment agent. This composition has a heat and moisture resistance needs for a semiconductor sealing material, and as well as a low elastic modulus.

REFERENCES:
patent: 4624998 (1986-11-01), Keil
patent: 4701482 (1987-10-01), Itoh et al.
patent: 4720515 (1988-01-01), Iji et al.
172nd Meeting of the Electrochemical Society, entitle "Effect of the Molecular Weight of Silicone Flexibilizer on the Properties of Epoxy Molding Compound", Oct., 1987.

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