Semiconductor resin sealing apparatus

Plastic article or earthenware shaping or treating: apparatus – Distinct means to feed – support or manipulate preform stock... – Opposed registering coacting female molds

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Details

425143, 425144, 425547, 425DIG13, 26427217, 249 78, 219449, B29C 4573, B29C 4578

Patent

active

054155355

ABSTRACT:
A chase is arranged on a heating plate of a die set. Semiconductor packages are arranged, as products to be heated, in cavities of the chase. A runner is provided in the surface of the chase to feed a molten resin into the cavities. The heating plate has a hole for a rod-like heater and a hole for a temperature monitoring sensor. The rod-like heater is inserted into the heater insertion hole and the sensor is inserted into the sensor insertion hole. The heater has a plurality of mutually independent heat generation areas in its axial direction. The sensor detects temperature at the heat generation areas of the heater. A control section monitors the temperature near the respective heat generation areas of the rod-like heater and sets the temperature at the respective heat generation areas of the rod-like heater to a predetermined level.

REFERENCES:
patent: 3370120 (1968-02-01), Lasch
patent: 4208574 (1980-06-01), Schafer
patent: 4586690 (1986-05-01), Hartel et al.
patent: 4609343 (1986-09-01), Tejfalussy
patent: 4659304 (1987-04-01), Day
patent: 4711989 (1987-12-01), Yu
patent: 4856979 (1989-08-01), Schreck
patent: 5108278 (1992-04-01), Tsutsumi et al.
patent: 5158132 (1992-10-01), Guillemot
patent: 5258601 (1993-11-01), Takano

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