Semiconductor relay apparatus and wiring board fabrication...

Details Semiconductor relay apparatus and wiring board fabrication... Semiconductor relay apparatus and wiring board fabrication...

2007-03-13

2007-03-13

Epps, Georgia (Department: 2878)

Radiant energy

Photocells; circuits and apparatus

Housings

C250S2140SW

Reexamination Certificate

active

11059568

ABSTRACT:
Three chips, i.e., an LED, photovoltaic IC, and MOS-FET, are mounted on a silicon substrate having two projections arranged substantially parallel to each other. Each projection has a side surface formed by an inclined surface including a curve having an inflection point. The LED is mounted on an LED mounting electrode formed between the two projections, and connected, by a gold wire, to an LED connecting electrode formed between the projections. The photovoltaic IC is placed on the front-side surfaces of the projections so as to oppose the LED, and connected via gold bumps.

REFERENCES:
patent: 6603238 (2003-08-01), Sakata et al.
patent: 6614964 (2003-09-01), Kuhara et al.
patent: 2001/0024553 (2001-09-01), Nakanishi et al.
patent: 2003/0123819 (2003-07-01), Nakanishi et al.
patent: 2003/0169981 (2003-09-01), Nakanishi et al.
patent: 2004/0137661 (2004-07-01), Murayama
patent: 11-163705 (1999-06-01), None

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