1984-10-30
1986-08-05
Edlow, Martin H.
357 76, 357 81, H01L 2348, H01L 2502, H01L 2702
Patent
active
046046437
ABSTRACT:
A semiconductor rectifier device includes a heat-radiating substrate, a flame-sprayed insulating layer formed directly on a surface of the substrate, at least one first flame-sprayed metal layer selectively formed on the surface of the radiation substrate, and a second metal layer selectively formed on the flame-sprayed insulating layer. A rectifying circuit has first and second rectifying elements which are electrically coupled, respectively, at terminals of opposite polarities, with the first flame-sprayed metal layer and the second flame-sprayed metal layer. An electrode electrically connects the terminals of the rectifying elements having polarities opposite to those of the terminals connected to the first and second flame-sprayed layers.
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M. Yamauchi et al., "Arc Plasma Sprayed Electrical Circuits and Sputtering Targets", 10 J. Spray Coating Soc'y of Japan, 2:23 (1973).
Kubota Katsuhiko
Sekiba Toshinobu
Yotsumoto Yoshiharu
Edlow Martin H.
Jackson Jerome
Tokyo Shibaura Denki Kabushiki Kaisha
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