1985-03-26
1986-04-29
Edlow, Martin H.
357 72, 357 79, 357 81, H01L 2328, H01L 2302, H01L 2336
Patent
active
045860750
DESCRIPTION:
BRIEF SUMMARY
The invention relates to a semiconductor rectifier, and more particularly to a button-type rectifier with a cooling plate.
BACKGROUND
German Pat. No. 15 89 555 describes a semiconductor rectifier in which a semiconductor terminal has two parts. The second part of the terminal has a substantially larger diameter than does the first part. A mass of synthetic resin forms an outermost jacket and takes the form of a truncated cone. The synthetic resin jacket must be fabricated by transfer molding.
THE INVENTION
It is an object to provide a semiconductor rectifier which can be readily made, is totally encapsulated, and can be easily fitted into a cooling plate, while being protected in all aspects from environmental influences or damage.
Briefly, a cooling plate has an opening stamped therein which has a rim or ridge which is drawn out in a direction transverse to the major direction of the cooling plate to form a projecting rim or beam or collar. The rim or bead or collar may be short, and form a seating surface for a surrounding jacket. The semiconductor, secured to a terminal in form of a post or bolt, is press-fitted into the opening, and the space between the surrounding jacket and the semiconductor, including the upper edge of the collar or bead or rim, is filled with a resin compound, totally encapsulating the semiconductor, and a portion of a second terminal emanating centrally from the semiconductor. The collar may, however, also be drawn up parallel to the semiconductor, and the post sufficiently enlarged in the press-fitted area to form a clearance space between the semiconductor chip and the post which, then, can be filled with the resin compound, so that, again, the space between the semiconductor and the surrounding jacket, now formed by the rim or bead, is completely filled. The rim or bead can be extended in either direction, for example partly upwardly, partly downwardly--with respect to the axial extent of the semiconductor, and in relation to the plane of the cooling plate, so that the semiconductor is seated either essentially coplanar with the major extent of the cooling plate or, for example, within an end portion of the cooling rim or plate, not necessarily coincident with its major extent.
The semiconductor rectifier according to the invention has the advantage over the prior art that the synthetic resin mass can be poured by filling the space within a sheath or a cylindrical jacket, or the portion of the passage protruding beyond the bolt or socket-like second part of the first terminal, or by filling a conically opened portion of the cooling plate, respectively, to form an easily made and wholly encapsulated rectifier-cooling plate combination.
DRAWING
Three exemplary embodiments of the semiconductor rectifier according to the invention are shown in the drawing and explained in detail in the following description. Shown are:
FIG. 1, an axial section taken through the first exemplary embodiment;
FIG. 2, an axial section taken through the second exemplary embodiment; and
FIG. 3, an axial section taken through the third exemplary embodiment.
DESCRIPTION OF THE EXEMPLARY EMBODIMENTS
FIG. 1 shows a semiconductor rectifier formed, substantially, in a rotationally symmetrical manner, having a semiconductor chip 10 and two connector terminals 11 and 12, which are each soldered to a respective one of the two main surfaces of the semiconductor chip 10. The first terminal 11 thereby forms a bolt-like, solid metal base, which comprises a first part 11a soldered to the semiconductor chip 10 and a second part 11b which is provided with knurling. The second terminal 12 is a headed wire. The head part 12a of this headed wire is soldered to the semiconductor chip 10. A synthetic resin mass 13 is furthermore provided, which covers the rim of the semiconductor chip 10, the first part 11a of the first terminal 11 and portions of the second terminal 12. The second part 11b of the first connector terminal 11 which is provided with knurling is pressed into a cooling plate 14 serving to cool the re
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Heyke Klaus
Hossler Andreas
Schwenk Siegfried
Wallrauch Alexander
Edlow Martin H.
Jackson, Jr. Jerome
Robert & Bosch GmbH
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