Electric heating – Heating devices – Combined with container – enclosure – or support for material...
Reexamination Certificate
2006-08-01
2006-08-01
Paik, Sang (Department: 3742)
Electric heating
Heating devices
Combined with container, enclosure, or support for material...
C219S543000, C219S544000, C118S724000
Reexamination Certificate
active
07084376
ABSTRACT:
A ceramic board is provided which, when used as a heater, heats a silicon wafer uniformly throughout and, hence, does not damage the wafer and, when used as an electrostatic chuck, provides a sufficient chucking force. A ceramic board is provided for semiconductor manufacture apparatuses comprising a ceramic substrate and a semiconductor wafer mounted thereon directly or supported indirectly at a fixed distance from its surface, wherein the surface of said ceramic substrate, where said semiconductor wafer is to be mounted or supported, is controlled to a flatness of 1 to 50 μm over a measurement range of [(diametric end-to-end length)−10 mm].
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Hiramatsu Yasuji
Ito Yasutaka
Ibiden Co. Ltd.
Paik Sang
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