Semiconductor production apparatus

Chemistry: electrical and wave energy – Apparatus – Coating – forming or etching by sputtering

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20429813, C23C 1434

Patent

active

049649698

ABSTRACT:
A semiconductor production apparatus employs a target prepared by using a solder alloy which has a limited Sn content. The solder alloy can form an alloy layer having large elongation between a metal target and a backing plate to prevent undesirable cracking and separation of target, whereby a semiconductor device can be produced with a high degree of reliability.

REFERENCES:
patent: 3620957 (1971-11-01), Crawley et al.
patent: 4209375 (1980-06-01), Gates et al.
patent: 4290876 (1981-09-01), Nishiyama et al.
patent: 4341816 (1982-07-01), Lauterbach et al.
patent: 4448652 (1984-05-01), Pachonik
patent: 4569745 (1986-02-01), Nagashima

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