Semiconductor producing apparatus comprising wafer vacuum chucki

Details Semiconductor producing apparatus comprising wafer vacuum chucki Semiconductor producing apparatus comprising wafer vacuum chucki

1993-09-07

1996-07-09

Fourson, George

Coating apparatus

Gas or vapor deposition

Work support

118725, 118732, 269 21, 279 3, C23C 1600, B25B 1100, B23B 522, B23B 3130

Patent

active

055340733

ABSTRACT:
It is an object of the present invention to obtain a vacuum chucking which can vacuum suck a wafer even if dusts attach thereon. The main body of vacuum chuck (101) has a plurality of block grooves (125) on the surface on which the wafer (1) is sucked and fixed, in which vacuum evacuation paths (105) each for vacuum evacuating each block groove (125) are provided for each block groove (125). When the wafer(1) is sucked and fixed under low pressure, even if the degree of vacuum in one of the block grooves (125) decreases due to attachment of dusts on part of the suction surface, or the like, the wafer (1) can surely be sucked and held.

REFERENCES:
patent: 4131267 (1978-12-01), Ono et al.
patent: 4183545 (1980-01-01), Daly
patent: 4403567 (1983-09-01), daCosta et al.
patent: 4542298 (1985-09-01), Holden
patent: 4869481 (1989-09-01), Yabu et al.
patent: 5180000 (1993-01-01), Wagner et al.
patent: 5191218 (1993-03-01), Mori et al.
patent: 5324012 (1994-06-01), Aoyama et al.

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