Semiconductor processing workpiece position sensing

Details Semiconductor processing workpiece position sensing Semiconductor processing workpiece position sensing

1999-09-01

2002-02-26

Grant, William (Department: 2121)

Data processing: generic control systems or specific application

Specific application, apparatus or process

Product assembly or manufacturing

C702S150000, C438S017000, C205S082000, C216S090000

Reexamination Certificate

active

06351682

ABSTRACT:

TECHNICAL FIELD
The present invention relates to semiconductor workpiece position sensors and methods of monitoring the position of a semiconductor workpiece.
BACKGROUND OF THE INVENTION
The fabrication of semiconductor devices includes a plurality of processing steps. Individual devices are formed from die from a semiconductor workpiece such as a wafer. Typically there are four general categories of operations performed on a semiconductor wafer during the fabrication process. Such operations include layering, patterning, doping and heat treatments.
Layering provides thin layers to the surface of the semiconductor wafer. Patterning provides removal of selected portions of added surface layers. Doping of the semiconductor wafer is the process of applying specific amounts of dopants in the wafer surface through openings in the surface layers. Heat treatments of the semiconductor wafer involve operations in which the wafer is heated and/or cooled to achieve specific process results.
Numerous processing devices have been developed to implement the described processing steps of the semiconductor workpiece fabrication process. Depending upon the particular function of the workpiece and the processing device, various configurations are provided. Some conventional semiconductor workpiece processors utilize a semiconductor workpiece holder and a process bowl or container for implementing process steps such as plating. etching, etc.
The typical purpose of providing the workpiece holder and a process bowl is to enable the contacting of appropriate portions of the semiconductor wafer with a processing fluid held within the process bowl. General concerns during the fabrication process include directing the process fluid to the appropriate portions of the semiconductor wafer. Conventional semiconductor workpiece processors have utilized various techniques to shield the various portions of the semiconductor wafer which are not to be contacted by the process fluid. Examples of such conventional systems include applying tape to the back side of a semiconductor wafer to prevent process fluid from contacting the covered portions. Other configurations disclose holding the semiconductor workpiece with a suction cup arrangement to prevent fluid from coming in contact with the back side of the semiconductor wafer.
Although such conventional operations adequately fulfill the purpose of preventing process fluid from coming in contact with the back surface of the semiconductor wafer, other associated problems with the conventional systems still exist. For example, additional process steps are required including applying tape or covering the back surface of the semiconductor workpiece. Further, the semiconductor workpieces are fragile and care must be taken not to damage the wafer during covering of a surface of the wafer.
Therefore, a need exists to implement the semiconductor workpiece processing steps and control the application of process fluid to preselected portions of the semiconductor workpiece without the associated problems typically present in conventional semiconductor workpiece processors.


REFERENCES:
patent: 3302753 (1967-02-01), Rosenberg
patent: 3607549 (1971-09-01), Bielefeld, Jr. et al.
patent: 4662975 (1987-05-01), Dufresne et al.
patent: 4906341 (1990-03-01), Yamakawa et al.
patent: 4995939 (1991-02-01), Ferenczi et al.
patent: 5168886 (1992-12-01), Thompson et al.
patent: 5248380 (1993-09-01), Tanaka
patent: 5332445 (1994-07-01), Bergman
patent: 5571325 (1996-11-01), Ueyama et al.
patent: 5573624 (1996-11-01), Barbee et al.
patent: 5578167 (1996-11-01), Sooriakumar et al.
patent: 5747689 (1998-05-01), Hampo et al.
patent: 5882425 (1999-03-01), Graham
patent: 5985126 (1999-11-01), Bleck et al.
patent: 6015462 (2000-01-01), Doolittle
patent: 6090711 (2000-07-01), Batz, Jr. et al.

Affiliated with

Also associated with

Rating

Semiconductor processing workpiece position sensing does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor processing workpiece position sensing, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor processing workpiece position sensing will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2960362