Semiconductor processing using vapor mixtures

Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With microwave gas energizing means

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34 72, 34 84, 34523, 118715, 134 13, 134 30, 1341021, 134200, 134902, 438706, 438707, 438714, 438716, 438114FOR, B08B 310, H01L 2100

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059549114

ABSTRACT:
Processing methods and systems using vapor phase processing streams made from a liquid phase source and feed gas. Some versions use multiple liquid sources and multiple vapor generators which each produce vapors which are mixed. Some of the vapor generators use metering pumps to inject a controlled flow of liquid into a controlled flow of feed gas. In some embodiments the vapors are exsiccated to reduce saturation before being introduced as a processing chamber vapor mixture into a processing chamber. The semiconductor pieces are preferably rotated within the processing chamber and can be processed in batches.

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