Semiconductor processing technique with differentially fluxed ra

Metal treatment – Compositions – Heat treating

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29576B, 29576T, 148175, 148187, 148DIG93, 156635, 156643, 427 531, H01L 21265, B05D 512

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active

046700633

ABSTRACT:
A semiconductor processing technique is disclosed for periodically selectively effecting lattice ordering and dopant distribution during a semiconductor layer formation process. Excimer pulsed ultraviolet laser radiation is provided at different energy fluxes to provide an electrically active layer as formed, without post-annealing, and curing lattice damage otherwise due to certain processing methods such as ion implantation. In a photolytic deposition technique, excimer laser radiation is periodically increased to transiently provide a pyrolytic thermal reaction in the layer as thus far deposited to provide a plurality of short intermittent periodic annealing steps to ensure crystallization as the layer continues to be deposited at lower radiation energy fluxes. Single crystalline material may be formed without post-annealing by periodically irradiating incremental thicknesses of the layer as formed.

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patent: 4529617 (1985-07-01), Chenevas-Paule et al.
Deutsch in Mat. Res. Soc. Symp. #17, ed. Osgood et al., Elseviy, 1983, p. 225.
Young et al., Solid St. Technol. 26, (1983), p. 183.
Ehrlich et al., IEEE J. Quantum Electronics, QE--16, (1980), 1233.
Bauerle, D. in Laser--Photochemical Processing--Dences, ed. Osgood et al., North Holland, N.Y., 1982, p. 19.
Eden et al., Ibid, p. 185.

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