Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With measuring – sensing – detection or process control means
Reexamination Certificate
2006-08-15
2006-08-15
McDonald, Rodney G. (Department: 1753)
Adhesive bonding and miscellaneous chemical manufacture
Differential fluid etching apparatus
With measuring, sensing, detection or process control means
C156S345240, C156S345310, C156S345320, C118S719000, C204S298250
Reexamination Certificate
active
07090741
ABSTRACT:
A semiconductor processing system includes a common transfer chamber (34) having first and second compartments (46, 48) partitioned by a partition wall (44). First and second vacuum processing apparatuses (32E,32A) are respectively connected to the first and second compartments (46, 48). A pressure control section (PCS) controls the pressures inside the first and second compartments (46, 48). The pressure control section (PCS) includes first and second vacuum pumps (68, 70) respectively connected to the first and second compartments (46, 48), and a line (76) connecting the delivery side of the second vacuum pump (70) to the suction side of the first vacuum pump (68). The pressure control section (PCS) performs a setting such that a second ultimate pressure or lowest operational pressure of the second compartment (48) is lower than a first ultimate pressure or lowest operational pressure of the first compartment (46).
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Machine Translation of 10-270527 and 11-230036.
Narushima Masaki
Saeki Hiroaki
McDonald Rodney G.
Oblon & Spivak, McClelland, Maier & Neustadt P.C.
Tokyo Electron Limited
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