Coating apparatus – Gas or vapor deposition – Multizone chamber
Reexamination Certificate
2008-04-01
2008-04-01
Moore, Karla (Department: 1763)
Coating apparatus
Gas or vapor deposition
Multizone chamber
C156S345310, C156S345320, C156S345290
Reexamination Certificate
active
07351291
ABSTRACT:
A semiconductor processing system includes a load lock chamber and first to third process chambers connected to an airtight transfer chamber. The second process chamber is disposed below the first process chamber and overlaps with the first process chamber. The third process chamber is disposed at a position laterally distant from the first process chamber and leveled with the first process chamber. First to third exhaust ports are formed in the bottoms of the first to third process chambers, and connected to respective vacuum exhaust sections through first to third exhaust lines. A transfer mechanism is disposed in the transfer chamber to transfer a target substrate to and from the load lock chamber and the first to third process chambers.
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Moore Karla
Oblon & Spivak, McClelland, Maier & Neustadt P.C.
Tokyo Electron Limited
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