Semiconductor processing system

Details Semiconductor processing system Semiconductor processing system

1998-02-05

2000-09-19

Lund, Jeffrie R

Coating apparatus

Gas or vapor deposition

118725, 156345, C23C 1600

Patent

active

061206059

ABSTRACT:
A single wafer processing type of a semiconductor processing system is provided so as to achieve that residual particles inside a reactor thereof are efficiently removed and a gas injected into the reactor is uniformly flowed over a wafer in a wide range of the gas flow rate. The semiconductor processing system includes gas flow adjusting means (28, 29, 30) having a slit (30) communicated with an exhaust port (35) for pumping out a gas injected into a reactor (10) from the reactor (10). The slit (30) is provided annularly around a circumference of a wafer (34) and positioned below a position of the wafer (34), and a width of the slit (30) is narrowed about the exhaust port (35).

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