Semiconductor processing of silicon nitride

Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board

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96 351, 134 2, 427307, 427318, 427327, 427344, 427352, 156659, H01L 21304, H01L 21306

Patent

active

040753670

ABSTRACT:
A method of providing improved adherence of photoresist to a silicon nitride layer on a semiconductor wafer by first preparing a heated solution of trichlorophenylsilane, immersing the nitride coated wafer in the trichlorophenylsilane solution, drying and baking the wafer prior to the application of the photoresist.

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patent: 3962004 (1976-06-01), Sonneborn

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