Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board
Patent
1976-03-18
1978-02-21
Kendall, Ralph S.
Coating processes
Electrical product produced
Integrated circuit, printed circuit, or circuit board
96 351, 134 2, 427307, 427318, 427327, 427344, 427352, 156659, H01L 21304, H01L 21306
Patent
active
040753670
ABSTRACT:
A method of providing improved adherence of photoresist to a silicon nitride layer on a semiconductor wafer by first preparing a heated solution of trichlorophenylsilane, immersing the nitride coated wafer in the trichlorophenylsilane solution, drying and baking the wafer prior to the application of the photoresist.
REFERENCES:
patent: 3482977 (1969-12-01), Baker
patent: 3549368 (1970-12-01), Collins
patent: 3586554 (1971-06-01), Couture et al.
patent: 3706612 (1972-12-01), Palmer
patent: 3758306 (1973-09-01), Roos
patent: 3867218 (1975-02-01), Henry
patent: 3898351 (1975-08-01), Kennison
patent: 3911169 (1975-10-01), Lesaicherre
patent: 3962004 (1976-06-01), Sonneborn
Bergstedt Lowell C.
Cavender J. T.
Dalton, Jr. Philip A.
Kendall Ralph S.
NCR Corporation
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