Semiconductor processing methods

Details Semiconductor processing methods Semiconductor processing methods

2006-06-27

2006-06-27

Nelms, David (Department: 2818)

Semiconductor device manufacturing: process

Chemical etching

Combined with the removal of material by nonchemical means

C438S951000

Reexamination Certificate

active

07067426

ABSTRACT:
The invention includes methods of forming patterns in low-k dielectric materials by contact lithography. In a particular application, a mold having a first pattern is pressed into a low-k dielectric material to form a second pattern within the material. The second pattern is substantially complementary to the first pattern. The mold is then removed from the low-k dielectric material. The invention also includes a method of forming a mold; and includes a mold configured to pattern a mass over a semiconductor substrate during contact lithography of the mass.

REFERENCES:
patent: 5348616 (1994-09-01), Hartman et al.
patent: 5527586 (1996-06-01), Schuler et al.
patent: 5597613 (1997-01-01), Galarneau et al.
patent: 5658575 (1997-08-01), Ribier et al.
patent: 5735985 (1998-04-01), Ghosh et al.
patent: 6110401 (2000-08-01), Lee et al.
patent: 6190929 (2001-02-01), Wang et al.
patent: 6225143 (2001-05-01), Rao et al.
patent: 6309580 (2001-10-01), Chou
patent: 6482742 (2002-11-01), Chou
patent: 6517995 (2003-02-01), Jacobson et al.
patent: 6580172 (2003-06-01), Mancini et al.
patent: 6716754 (2004-04-01), Hofmann
“Information About HS II RTV High Strength Moldmaking Silicone Rubber Product Line” Down Corning: 1992.
“Large scale nanolithography using nanoimprint lithography”: Babak Heidari, Ivan Maxinov, Eva-Lena Sarwe, and Lars Montelius: J.Vac.Sci. Techol. B17(6), Nov./Dec. 1999: 1999 American Vacuum Society: pp. 2961-2964.
Website: http://www.dow.com/cyclotene/prods/prod1.htm: Cyclotene: Photosensitive Resins: May 14, 2001.
Website: http://www.dow.com/cyclotene/apps/app11.htm: Cyclotene: Bumping/Redistribution/Wafer Level Packaging (WLP): May 14, 2001.
Website: http://www.dow.com/cycotene/apps/app13.htm: Cyclotene: Multilayer Interconnects: May 14, 2001.
Website: http://www.dow.com/cyclotene/over.htm; Cyclotene: BCB Properties; May 14, 2001.
Website: http://www.dow.com/cyclotene/over/tg.htm; Tg vs Cure; May 14, 2001.
“New polymer materials for nanoimprinting”; H. Schulz et al.;J. Vac. Sci. Techol. B18(4) Jul./Aug. 2000; pp. 1861-1865.

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