Semiconductor processing method for providing large grain polysi

Fishing – trapping – and vermin destroying

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437161, 437247, 148DIG1, H01L 2122

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054911079

ABSTRACT:
A semiconductor processing method of providing a polysilicon layer atop a semiconductor wafer comprises the following sequential steps: a) depositing a first layer of arsenic atop a semiconductor wafer; b) depositing a second layer of silicon over the arsenic layer, the second layer having an outer surface; c) first annealing the wafer at a temperature of at least about 600.degree. C. for a time period sufficient to impart growth of polycrystalline silicon grains in the second layer and providing a predominately polysilicon second layer, the first annealing step imparting diffusion of arsenic within the second layer to promote growth of large polysilicon grains; and d) with the second layer outer surface being outwardly exposed, second annealing the wafer at a temperature effectively higher than the first annealing temperature for a time period sufficient to outgas arsenic from the polysilicon layer. As an alternate consideration, the layer of silicon could be in situ provided with an effective quantity of As during deposition.

REFERENCES:
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patent: 5310698 (1994-05-01), Wild
Aoyama et al., "Leakage Currents Reduction of Poly-Si TFT's by Two Step Annealing", Extended Abstracts of the 22nd (1990 International) Conference on Sol. St. Dev. and Materials, pp. 389-392.
Gorkum et al., "Controlled Atomic Layer Doping and ALD MOSFET Fabrication in Si", Japanese Journal of Applied Physics, vol. 26, No. 12, pp. L1933-L1935, Dec. 1987.
Gong et al., "A metal-oxide-silicon field-effect transistor made by means of solid-phase doping", J. Appl. Phys., 65(11), pp. 4435-4437, Jun. 1989.
C. V. Thomoson, "Grain Growth In Polycrystalline Silicon Films" Dept. of Materials Science and Engineering, Massachusetts Institute of Technology, Cambridge, MA. Mat. Res. Soc. Symp. Proc. vol. 106, 1988.

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