Semiconductor processing furnace outflow cooling system

Heating – Work chamber having heating means – Having particulate or liquid heat transfer medium in work...

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432 72, 432241, 34 78, F27B 1500

Patent

active

059082925

ABSTRACT:
A vertically oriented thermal processor for processing batches of semiconductor wafers held within a processing chamber. The processing chamber is contained within a processing vessel. Processing gases are discharged through a processing chamber outflow. An outflow cooler is included to cool gases exhausting from the processing chamber outflow. The outflow cooler includes a fluid heat exchanger and a flow diverter which directs the exhausting gases against cooled walls of the outflow cooler. The cooler also preferably has a liner which lines a casing to which the heat exchanger is connected.

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