Semiconductor processing furnace

Heating – With work cooling structure

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

432152, 432241, F27D 1502

Patent

active

059477180

ABSTRACT:
A vertically oriented thermal processor for processing batches of semiconductor wafers held within a processing chamber. The processing chamber is contained within a processing vessel. A furnace liner surrounds the processing vessel in spaced relationship. A first flow of cooling fluid is supplied upwardly between the processing vessel and furnace liner. The incoming first flow also serves to cool the base plate assembly which is constructed to shield the processing chamber from off-gassing. A second flow path of cooling fluid is supplied downwardly between the furnace liner and an inner wall of the furnace heater in countercurrent relationship to the first flow. An outflow baffle and outflow cooler are also advantageously included to isolate the processing chamber and cool the exhausting gases. A preferred power supply system is also described.

REFERENCES:
patent: 4579080 (1986-04-01), Martin et al.
patent: 4738618 (1988-04-01), Massey et al.
patent: 4925388 (1990-05-01), Iseki et al.
patent: 4937434 (1990-06-01), Nakao
patent: 5000682 (1991-03-01), Heidt et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Semiconductor processing furnace does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor processing furnace, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor processing furnace will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1797514

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.