Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With measuring – sensing – detection or process control means
Reexamination Certificate
2005-03-15
2005-03-15
Hassanzadeh, Parviz (Department: 1763)
Adhesive bonding and miscellaneous chemical manufacture
Differential fluid etching apparatus
With measuring, sensing, detection or process control means
C118S712000, C134S001000
Reexamination Certificate
active
06866744
ABSTRACT:
A semiconductor processing apparatus for applying plasma treatment to a sample arranged in a vacuum process chamber includes a plasma generator for generating plasma inside the vacuum process chamber and a process gas supply for introducing a process gas into the vacuum process chamber. The apparatus further includes an oscillator for imparting mechanical oscillation to the semiconductor processing apparatus, a receiver for detecting mechanical oscillation generated by the oscillator in the semiconductor processing apparatus as a signal, and an analyzer for analyzing the detected signal to diagnose whether the vacuum process chamber is normally assembled.
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Miya Go
Tanaka Junichi
Tetsuka Tsutomu
Yamamoto Hideyuki
Hassanzadeh Parviz
Hitachi High-Technologies Corporation
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