Semiconductor processing apparatus

Details Semiconductor processing apparatus Semiconductor processing apparatus

1997-05-14

1999-11-02

Krynski, William

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With microwave gas energizing means

118730, 118733, C23F 100, C23C 1600

Patent

active

059763124

ABSTRACT:
There is provided an integrated semiconductor processing apparatus which produces less dust. The apparatus comprises a reaction chamber, a boat means, a motor, and a sealing mechanism. The sealing mechanism includes a movable sealing means which serves as a non-contact seal when a wafer is being rotated and which serves as a contact seal when the wafer is static. The movable sealing means is an expandable elastic seal comprising an expandable elastic member. By increasing the pressure inside the expandable elastic seal, the surface of the elastic seal is put in contact with a rotating shaft to achieve perfect sealing. The internal pressure of the expandable elastic seal can be adjusted to control the contact and non-contact state of the seal. The apparatus according to the invention suppresses generation of dust in all steps of etching to improve production yield.

REFERENCES:
patent: 5016576 (1991-05-01), Iwabuchi et al.

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