Semiconductor pressure transducer

Measuring and testing – Fluid pressure gauge – Diaphragm

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22826313, 338 4, G01L 906

Patent

active

044997744

ABSTRACT:
A semiconductor pressure transducer comprising a piezoresistive semiconductor diaphragm, a cylindrical stem made of a glass having a thermal expansion coefficient approximating that of the diaphragm and hermetically bonded by anodic bonding to the latter, and a cylindrical holder hermetically bonded by anodic bonding to the cylindrical stem is disclosed. The holder is made of a ferromagnetic alloy material containing Fe, Co and Ni and having a mean thermal expansion coefficient of 35.times.10.sup.-7 /.degree.C. or less within the temperature range between 30.degree. C. and 350.degree. C.

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Kurtz et al., "A Solid State Bonding and Packaging Technique for Integrated Sensor Transducers", ISA ASI 73246 (1973), 229-238.

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