Semiconductor pressure sensor module

Details Semiconductor pressure sensor module Semiconductor pressure sensor module

1997-03-18

1999-01-12

Tolin, Gerald P.

Electricity: electrical systems and devices

Electrostatic capacitors

Variable

73721, 73727, 338 42, G01L 906, G01L 708

Patent

active

058597590

ABSTRACT:
The semiconductor pressure sensor has a pressure sensor unit with a pressure sensor chip for detecting pressure, peripheral circuitry for converting the pressure detected by the pressure sensor unit to an electrical signal and processing the electrical signal, a lead frame for fastening and electrically connecting peripheral circuitry, a package in which the peripheral circuitry and lead frame are integrated in a resin molding including a cavity in which the pressure sensor unit is housed, a cover for closing the opening of the cavity in which the pressure sensor unit is housed, and a pressure opening for conveying a pressure-conveying medium to the pressure sensor chip. The pressure sensor unit is fastened to the inside bottom of the cavity and is electrically connected to a particular part of the lead frame exposed inside the cavity.

REFERENCES:
patent: 4129042 (1978-12-01), Rosvold
patent: 4939497 (1990-07-01), Nishida
patent: 5186055 (1993-02-01), Kovacich
patent: 5257547 (1993-11-01), Boyer
patent: 5454270 (1995-10-01), Brown

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