Semiconductor pressure sensor and related methodology with polys

Electrical resistors – Strain gauge type – Fluid- or gas pressure-actuated

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

73862474, 338 42, G01L 122

Patent

active

055898106

ABSTRACT:
A semiconductor pressure sensor utilizes single-crystal silicon piezoresistive gage elements dielectrically isolated by silicon oxide from other such elements, and utilizes an etched silicon substrate. P-type implants form p-type piezoresistive gage elements and form p+ interconnections to connect the sensor to external electrical devices. The diaphragm is made from polysilicon and is deposited on top of the gage elements.

REFERENCES:
patent: 3930823 (1976-01-01), Kurtz et al.
patent: 3938175 (1976-02-01), Jaffe et al.
patent: 4320664 (1982-03-01), Rehn et al.
patent: 4456901 (1984-06-01), Kurtz et al.
patent: 4510671 (1985-04-01), Kurtz et al.
patent: 4672354 (1987-06-01), Kurtz et al.
patent: 4721938 (1988-01-01), Stevenson
patent: 4975390 (1990-12-01), Fujii et al.
patent: 4994781 (1991-02-01), Sahagen
patent: 5074152 (1991-12-01), Ellner et al.
patent: 5088329 (1992-02-01), Sahagen
patent: 5095401 (1992-03-01), Zavracky et al.
patent: 5165289 (1992-11-01), Tilmans
patent: 5220838 (1993-06-01), Fung et al.
patent: 5316619 (1994-05-01), Mastrangelo
patent: 5357807 (1994-10-01), Guckel et al.
European Search Report dated May 6, 1996 in European Patent Application No. 95103970.0.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Semiconductor pressure sensor and related methodology with polys does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor pressure sensor and related methodology with polys, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor pressure sensor and related methodology with polys will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1144624

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.