Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1989-03-13
1991-01-22
Weston, Caleb
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
73726, 357 80, B32B 3104
Patent
active
049868616
ABSTRACT:
A semiconductor pressure sensor having a cylindrical housing with an opening formed at its tip end which is exposed to a pressure atmosphere and a metal diaphragm for receiving pressure, which is formed in a wall of the cylindrical housing defining the opening. A metal oxide layer is formed in a surface of the metal diaphragm by oxidizing the surface of the metal diaphragm, and a glass layer is formed on the metal oxide layer. A semiconductor chip, on which a strain gauge is formed, is firmly and surely bonded to the metal diaphragm through the glass layer by virtue of the metal oxide layer. This semiconductor pressure sensor can measure high pressure with sufficient sensitivity and high accuracy.
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patent: 4445385 (1984-05-01), Endo
patent: 4592794 (1986-06-01), Davis et al.
patent: 4820659 (1989-04-01), Dholakia et al.
Ando Yoshiyasu
Hattori Tadashi
Huzino Seizi
Mizuno Naohito
Nishida Minoru
Nippon Soken Inc.
Weston Caleb
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