Measuring and testing – Fluid pressure gauge – Electrical
Reexamination Certificate
2006-09-22
2008-08-19
Allen, Andre J. (Department: 2855)
Measuring and testing
Fluid pressure gauge
Electrical
C073S754000, C073S706000
Reexamination Certificate
active
07412895
ABSTRACT:
A semiconductor pressure sensor is provided with a semiconductor pressure sensor part that converts a pressure to an electrical signal, a sensor module in which said semiconductor pressure sensor part and a terminal of which part is extended to the outside are insert-molded with a first resin, and an outer case in which said sensor module is contained, and said sensor module is further insert-molded with a second resin to form a connector portion, and the semiconductor pressure sensor is characterized in that the exposed portion of the sensor module from the second resin, and the boundary between the exposed portion of the sensor module and the second resin are covered with an adhesive.
REFERENCES:
patent: 5900554 (1999-05-01), Baba et al.
patent: 5948991 (1999-09-01), Nomura et al.
patent: 6521966 (2003-02-01), Ishio et al.
patent: 6601453 (2003-08-01), Miyazaki et al.
patent: 6615669 (2003-09-01), Nishimura et al.
patent: 6718829 (2004-04-01), Baba et al.
patent: 6807864 (2004-10-01), Takakuwa et al.
patent: 6951136 (2005-10-01), Kato
patent: 6955091 (2005-10-01), Fujimoto et al.
patent: 6964200 (2005-11-01), Miyazaki et al.
patent: 7043993 (2006-05-01), Hayashi et al.
patent: 7055391 (2006-06-01), Tokuhara
patent: 7216546 (2007-05-01), Hayashi et al.
patent: 7260992 (2007-08-01), Hayashi et al.
patent: 2005/0115328 (2005-06-01), Hayashi et al.
patent: 10-170380 (1998-06-01), None
patent: 2000-337987 (2000-12-01), None
patent: 02/079743 (2002-10-01), None
patent: 03/062779 (2003-07-01), None
patent: WO 03/062779 (2003-07-01), None
Asada Shinsuke
Nakamura Hiroshi
Taruya Masaaki
Allen Andre J.
Jenkins Jermaine
Mitsubishi Electric Corp.
Sughrue & Mion, PLLC
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