Semiconductor pressure sensor

Electrical resistors – Strain gauge type – With temperature compensation

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Details

338 5, G01L 122

Patent

active

052203050

ABSTRACT:
A semiconductor pressure sensor chip has a pattern including first diffusion sections in which external connection contacts are formed. Resistors are connected to the first diffusion sections through second diffusion sections in a bridge circuit such that the distances between a contact and the second diffusion sections connected to a first diffusion section where the contact is disposed are equal. This arrangement reduces drift of the offset voltage with changes in temperature, thus providing a high precision semiconductor pressure sensor with an improved yield.

REFERENCES:
patent: 4320664 (1982-03-01), Rehn et al.
patent: 4404539 (1983-09-01), Yamada et al.
patent: 4462018 (1984-07-01), Yang et al.
patent: 4556807 (1985-12-01), Yamada et al.
patent: 5002901 (1991-03-01), Kurtz et al.

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