Semiconductor power module with identical mounting frames

Details Semiconductor power module with identical mounting frames Semiconductor power module with identical mounting frames

1993-10-22

1995-02-21

Hille, Rolf

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

257724, 257925, H01L 2991, H01L 2503, H01L 2152, H01L 2160

Patent

active

053919190

ABSTRACT:
A semiconductor device module is formed of four identical frame sections which each have a flat base and perpendicularly extending strap terminal. Semiconductor chips are soldered to the center of the top surfaces of each base, and the devices are interconnected by flat brass strips having one end soldered to the top of one chip and the other end soldered to the base of an adjacent section. The base sections lie in a common plane at the bottom of an insulative filled insulation cup. The terminals extend parallel and out of the top of the cup.

REFERENCES:
patent: 4488167 (1984-12-01), Neidig et al.
patent: 4724474 (1988-02-01), Duchek et al.
patent: 5280194 (1994-01-01), Richards et al.

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