Semiconductor power module with ceramic substrate

Details Semiconductor power module with ceramic substrate Semiconductor power module with ceramic substrate

1986-06-16

1988-03-15

James, Andrew J.

357 74, 357 79, H01L 2330, H01L 2304, H01L 2310, H01L 21447

Patent

active

047316446

ABSTRACT:
A semiconductor power module includes a plastic housing, a ceramic substrate with upper and lower surfaces being disposed in the housing, upper and lower metallizations respectively disposed on the upper and lower surfaces of the substrate, components disposed on the upper metallization, at least one support having upper and lower parts and being disposed on the substrate in the housing, a first elastomeric soft casting compound disposed in the housing covering the substrate and the lower part of the at least one support, the upper part of the at least one support protruding from the first casting compound, and a second thermo-setting hard casting compound covering the upper part of the at least one support and connecting the upper part to the housing.

REFERENCES:
patent: 3585455 (1971-06-01), Naylor et al.
patent: 4558510 (1985-12-01), Tani et al.

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