Semiconductor power module with an integrated heat pipe

Details Semiconductor power module with an integrated heat pipe Semiconductor power module with an integrated heat pipe

1986-02-14

1988-02-23

Scott, J. R.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

361388, 357 82, 174 15HP, 16510433, H05K 720, F28D 1502

Patent

active

047274557

ABSTRACT:
A semiconductor power module includes a metallized ceramic carrier plate having an opening formed therein, a semiconductor power component with a base area of a given size adjacent the ceramic plate at the opening, a heat pipe integrated in the semiconductor power module having a vapor space, a condensation zone and a heating zone for distributing heat removed from the semiconductor power component at the heating zone over an area of the condensation zone being larger than the given area, a highly heat-conducting ceramic base plate having two metallized sides, and a frame vacuum-tightly interconnecting the carrier plate and the base plate forming the vapor space of the heat pipe therebetween.

REFERENCES:
patent: 4212349 (1980-07-01), Andros et al.
patent: 4327399 (1982-04-01), Sasaki et al.
patent: 4551787 (1985-11-01), Mittal et al.

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