Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Patent
1994-07-05
1996-05-28
Limanek, Robert P.
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Insulating material
257723, 257687, 257706, H01L 2316, H01L 2702
Patent
active
055214371
ABSTRACT:
An insulating metallic board 160 mounting IGBTs which control an electrical power and other circuit elements and an insulating board 170 mounting semiconductor elements which control the IGBTs and the other circuit elements are arranged adjacent to or closely parallel to each other, and combined by a frame 180 into one integral circuit board to define a composite board 150. Wiring patterns 161 and 171 on which the respective circuit elements are to be disposed are formed on major surfaces of the same side. Since the composite board 150 which includes the two different types of circuit boards can be treated simply as one board, it is possible to mount the circuit elements onto the two different types of boards at the same time in one fabrication step. Thus, the number of fabrication steps and a manufacturing cost are reduced.
REFERENCES:
patent: 4639759 (1987-01-01), Neidig et al.
patent: 4916502 (1990-04-01), Oshima
patent: 4965710 (1990-10-01), Pelly et al.
patent: 5006920 (1991-04-01), Schafer et al.
patent: 5077595 (1991-12-01), Fukunaga
patent: 5291065 (1994-03-01), Arai et al.
patent: 5347158 (1994-09-01), Matsuda et al.
1989 IEEE Industry Applications Society Annual Meeting, Part II, San Diego, California, Oct. 1-5, 1989, pp. 1356-1362, G. Majumdar et al.: "A New Series of Smart Controllers".
Patent Abstracts of Japan vol. 16 No. 521 (E-1285), 27 Oct. 1992 & JP-A-04-196345 (Nissan Motor) *abstract*.
Oota Tatsuo
Oshima Seiichi
Hardy David B.
Limanek Robert P.
Mitsubishi Denki & Kabushiki Kaisha
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